OCP APAC Summit, Taiwan

Event • August 05, 2025

Join Us at the OCP APAC Summit 2025!

🌟 Event: OCP APAC Summit
📅 Date: August 5-6, 2025
📍 Location: Taipei Nangang Exhibition Center Hall 2, Booth G12

Powering data center innovations from grid-to-chip

Flex Embedded and Critical Power is proud to showcase our cutting-edge grid-to-chip solutions, purpose-built for the evolving needs of modern data centers. Visit us at Booth G12 to explore our latest DC/DC products and integrated solutions designed to optimize performance, efficiency, and scalability. We’ll also feature innovations from our Embedded Power teams, as well as advanced offerings from Anord Mardix, a Flex company.

Why visit our booth?

Network with Industry Leaders: Connect with professionals and experts in the field.
Experience the Latest Innovations: Get hands-on with our newest DC/DC products and cutting-edge technologies that are reshaping data center performance and efficiency.
Discover What’s Next: Gain valuable insights into the future of power management and emerging trends driving the evolution of data center infrastructure.

Don't Miss Out!
Mark your calendars and visit us at Booth G12. For more information, feel free to contact us at pm.info@flex.com.

We look forward to seeing you at the OCP APAC Summit!

Share via email